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  • Perform device level FA in a collaborative environment to support customer returns, product qualifications, yield excursions, and new product development.
  • Perform electrical and physical fault isolation on mixed-signal IC devices to identify root cause of failure in a timely and efficient manner
  • Produce technical reports of failure analysis findings
  • Evaluate and introduce new equipment and techniques to the failure analysis flow

Required Skills and Qualifications

  • Bachelors in Electrical Engineering and a minimum of six years proven track record in failure analysis of IC devices
  • Hands-on proficiency with electrical fault isolation tools and techniques such as photo-emission, static and dynamic laser stimulation, LVx, scan diagnostic techniques, ATE, thermal imaging, nanoprobing, and applications bench testing
  • In-depth understanding of CAD layout, ATE and bench test datalogs, digital and analog circuits, device physics, IC fabrication and assembly
  • Familiarity with common IC failure mechanisms and qual stress configurations
  • Excellent analytical skills and problem-solving ability
  • Strong technical writing and verbal communication skills

Preferred Skills and Qualifications:

  • Masters in Electrical Engineering
  • Two years experience in failure analysis of non-volatile memory (NVM) devices
  • Hands-on proficiency with physical failure analysis tools and techniques such as SEM, FIB, AFM, planar delayering, chemical deprocessing, chemical decoration